This course is an overview of the broad spectrum of processing approaches involved in "top down", "bottom up", and hybrid nanofabrication. The majority of the course details a step-by-step description of the equipment, facilities processes and process flow used in today's device and structure fabrication. Students learn to appreciate processing and manufacturing concerns including safety, process control, contamination, yield, and processing interaction. The students design process flows for micro- and nano-scale systems. Students learn the similarities and differences in "top down" and "bottom up" equipment and process flows by undertaking hands-on processing. This hands-on overview exposure covers basic nanofabrication processes including deposition, etching, and pattern transfer. This course is designed to be one of six capstone courses (Esc 211, 212, 213. 214, 215, 216) for the Penn State Semiconductor Manufacturing Technology (SMT) program. The course is lab intensive, leveraging the Nanofabrication Facility on the University Park campus. All lectures will be given in a technology classroom, Suite 114 Lubert bldg., Research Park. This classroom is dedicated to the Center for Semiconductor Manufacturing Technology and thus has a wide variety of very specialized, "hands-on" materials and facilities continually available to students. The course grade evaluation will use a mixture of tests, presentations, reports, and project assignments. Teaming and team problem solving will be stressed.